Hysol ® 1C     Email
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Epoxy Adhesive

Description
Dexter Hysol 1C is a general purpose adhesive and sealant that bonds, seals, and repairs a wide variety of materials including metals, most plastics, and wood.  Epoxie-Patch Kit 1C is also available in gray (EPK 6C) and black (EPK 11C).

Features
White Color                                             Machineable, Sandable                        High Service Temperature                                            Room Temp or Heat Cure                     Withstands Severe Environments

Typical Properties    
                                                             Part A                     Part B                                        Mixed
Color                                                    White                     Beige                                          White
Viscosity, Poise @ 25°C
Spindle 7, Speed 2                               -                               5000-9000                                  -
Spindle 7, Speed 10                             1200-3500               2000-4000                                  -             
Specific Gravity @ 77°F (Typical)       1.55                         1.65                                             1.55

Handling
                                                                  Part A                                                       Part B
By Weight                                                 100                                                            43
By Volume                                                2.5                                                             1
Pot Life @ 77°F, 100 grams                    20-25 minutes

Application
Mixing - Bulk:  Combine Part A (resin) and Part B (hardener) in the correct ratio and mix thoroughly until the color and consistency are uniform.  EPOXI-PATCH Tube Kits have been designed so that squeezing EQUAL LENGTH BEADS of Part A  2 hours at 140°F, 1 hour at 180°F, or 20-30 minutes at 250°F.  Heat cures can be modified to achieve a desired degree of cure from handling strength to full cure.

Application:  Bonding surfaces should be clean and dry.  For optimum surface preparation consult Dexter's Bulletin Preparing the Surface for Adhesive Bonding.  Once the adhesive is applied, the bonded parts should be held in contact until the part has developed handling strength.  It is not necessary to clamp the parts unless movement during cure is likely.

Cure:  Complete cure is obtained after three days at room temperature.  After 24 hours, approximately 90% of full cure properties are attained.  When in a bonded joint, EPK 1C will achieve handling strength in 3-4 hours at 77°F (note: this can vary with different bond configurations).  EPK 1C can also be cured with heat such as; 2 hours at 140°F, 1 hour at 180°F, or 20-30 minutes at 250°F.  Heat cures can be modified to achieve a desired degree of cure from handling strength to full cure.

Clean Up:  It is important to remove excess adhesive from the work area and application equipment before it hardens. Many common solvents and citrus cleaners are suitable for removing uncured adhesive.

Performance
Tensile Lab Shear Strength:  Tested on etched aluminum per ASTM D 1002.

Cure                                               Test Temp. °F                                Typical Results, psi
3 Days @ RT                                        -67                                                       1000
                                                               77                                                       1750
                                                              180                                                      1500
                                                              250                                                        700
                                                              300                                                        500
2 Hours @ 140°F                                 -67                                                       1500
                                                               77                                                       2100
                                                              180                                                      1700
                                                              250                                                        750
                                                              300                                                        550

Bulk Properties
Hardness (Shore D)                                                              60 Minimum @ 60°C
Glass Transition (Tg)                                                           98°C
Coefficient of Linear Thermal Expansion                           63 x 10 in/in/°C RT to Tg
Thermal Conductivity                                                           13 x 10-4 cal x cm/cm2 x sec x °C
Moisture Absorption            


DISCLAIMER: The information supplied in this document is for guidance only and should not be construed as a warranty.  All implied warranties are expressly disclaimed.  Including without limitation any warranty of merchantability and fitness for use: All users of the materials are responsible for assuring that it is suitable for their needs, environment and use.  All data is subject to change as Dexter deems appropriate.

Users should review the Material Safety Data Sheet (MSDS) and product label for the material to determine possible health hazards, appropriate engineering controls and precautions to be observed in using the material.  Copies of the MSDS and label are available upon request.

For more information or to order contact the Glu Guru™ at 1-800-323-5158
or Email mike@on-hand.com