EPOXY • SEALANTS • METHACRYLATES • STRUCTURAL ADHESIVES • HOT MELTS
HOT MELT DELIVERY SYSTEMS
Battery Packs • PCBA • Micro-Switches
Solenoids • Sensors • Connectors and Wire Harness
Your Premier IPC Destination
Low Pressure Over-molding Solutions
Low pressure molding is a single step process to encapsulate seal and protect electronics. Using a simple mold set allows for less material than traditional potting process.
UV Adhesive and UV Curing Equipment
UV and light curing adhesives are designed to adhere to a wide range of substrates in demanding applications. Formulated for bonding, coating and encapsulating properties, these adhesives are ideal for applications which require resistance to thermal cycling under vibration, environmental exposure or bio-compatibility.