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Multicore® Solder & Flux Materials
Multicore® No-Clean Fluxes Application: Spray/Foam
Multicore® Water Wash Fluxes-IPA Based
Multicore® Cored Wire
Multicore® Cleaners
Loctite® Brand Chipbonder® Syringe Dispense Adhesives
Thermal Management Adhesives

MultiCore® Solder and Flux Material
 The Multicore® line of solder pastes and fluxes are designed to meet the rigorous demands of a variety of electronic manufacturing  soldering processes. Whether your process requires long abandon times, wide process windows, or high-speed printing, we have a Multicore® solder and plus material to suit your needs.

Multicore® Solder & Flux Materials For more information or to order Call 1-800-323-5158
 MP200 Solder Paste WIDE PROCESS WINDOW A high activity, soft, colorless, low residue, no clean , solder paste that exhibits excellent print definition with long open and abandon time.
Alloy: 6N62/SN63 63S4 Anti-Tombstoning
% Metal Load 90 90.5 Tack: (G../MM2) 1.1 Print Speed 25-200

CR36™ No Clean Solder Paste HIGHEST ACTIVITY OFFERING A high activity colorless residue paste. Exhibits good abandon time, long stencil life and minimum hot slump.
Alloy: 6N62/SN63
% Metal Load 89.5 Tack: (G../MM2) 13-16 Print Speed 20-200

LF320™ Lead Free Paste WIDE PROCESS WINDOW A no clean flux system specially formulated for Pb-free alloys.High temperature tolerance and wide printing capability.
Alloy: 96SC
% Metal Load 88 Tack: (G../MM2) 1.2 Print Speed 20-150

WS200™ Water Wash Paste WIDE PROCESS WINDOW High performance water washable solder paste. Residues are readly removed with D1 Water, without the need for a saponifier.
Alloy: SN62/SN63
% Metal Load 90.5 Tack: (G../MM2) 0.8 Print Speed 25-100

Multicore® No-Clean Fluxes Application: Spray/Foam
X32-10™ No-Clean Flux - Clear Residue Wide Process Window A general pupose halide-free low solids flux which leaves clean, dry boards after wave soldering. Suitable for foam and spray flux application systems.
% Solids: 2.2 % Halides: Zero Acid Value: 15.3 IPC Class: REMO

MF200™ Liquid Flux - Contract Manufacturing Grade-Lead-Free Compatible A general purpose halide-free flux with sustained activity to extend flux life in dual wave and PB-free wave soldering applications. Suitable for spray flux application systems. Solvent-based flux may be thinned with IPA.
% Solids: 6.4 % Halides: Zero Acid Value: 48.5 IPC Class: ORMO

MF300™ VOC-Free-Clear Residue-Resin-Lead-Free  Compatible General purpose VOC-Free (water based), no clean, halide free and resin free flux with special formulation to minimize solder balling. Compatible with Pb-free processes. % Solids: 4.6% Halides: Zero Acid Value: 37 IPC Class: ORMO

MRF301™ IPA-Based Rosin Flux-Lead-Free  Compatible Higher solids flux for better wetting on reduced solderability surfaces and to minimize bridging on complex geometries. Fully Bp-Free and dual wave compatible. Solvent based flux may be thinned with IPA. % Solids: 6.5 % Halides: Zero Acid Value: 41 IPC Class: ROMO

Multicore® Water Wash Fluxes-IPA Based
Hydro-X/20™ High Activity Flux A high activity water washable flux designed for the soldering of the most difficult electronic assemblies. Unique activator package enables a wider process window and the soldering of all common electronic surfaces with ease.Residues are readily and completely removed by water wash after soldering. Suitable for lead-free wave soldering.
% Solids: 20 % Halides: 1.0 Acid Value: 24

Multicore® Cored Wire
Multicore® Cored Wire Typical wire diameters are 0.015, 0.024, 0.032. 0.040, and 0.064 In
400™ Halide-free, no clean, clear residue, increased flux content for improved wetting. Halide Content: Zero

502™ No clean, clear residue, minimal activation for increased wetting. Halide Content: 0.2%

Hydro-X™ High Activity water washable. Halide Content: 3%

Multicore® Cleaners
 Pozone™ SCO1™ Designed for the stencil cleaning and hand cleaning of process soldering residues. Highly effective cleaner that dries rapidy.

Loctite® Brand Chipbonder® Syringe Dispense Adhesives
Cornerbond 3515™ Specially formulated to allow component realignment in double sided reflow applications.
Color: Black Cure:In solid paste reflow cycle after paste has reached liquidation. Process Method: Syringe Dispense Self-Alignment
Storage: (Protect from heat 5C- + 3C Shelf Life: 6 months DOM Syringe Size: 30 ml STD

3621™ High performance for ultra high-speed syringe dispense. Good green strength. Superior humidity resisdtance and electrical properties. Can be used in lead-free solder applications.Room temperature storage capable.
Color: Red Cure: 90 sec. @ 150C or 2-3 min @ 125C Process Method: Very high speed Syringe Dispensing - 47,000 DPH capable Jettable
Storage: (Protect from heat 5C- + 3C or 8C-21C for 30 days Shelf Life: 10 months DOM Syringe Size: 10 and 30 ml STD, 30 ml Iwashita Clear syringe, 20 ml Panasert syringe, 30 ml Fuji syringe.
 

For more information and/or to order call 1-800-323-5158
or Email gluguru@on-hand.com