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UV Adhesives

Henkel's Loctite Indigo Visible Light Cure Acrylic Adhesive and Equipment Solutions>
Enter (Click) here for more information!


DYMAX ADHESIVES and COATINGS
Lighting The Way To Improved UVProcessing
Click image for full view 

DymaxUV.gif (33850 bytes)  The leader in UV curing is also the leader
in UV processing equipment. Dymax Light
WelderTM UV Systems are designed to
sharpen and maintain your competitive
edge through costs effective parts
processing. All are designed to provide the
exact light "shaped" to your requirements,
from small intensive UV spot lights and
concentrated beams to larger UV flooded
fields, for applications from hand-assembly
to total automation.

DYMAX PRODUCTS FOR
bulletTacking, Potting, Encapsulating
bulletConformal Coatings
bulletThermally Conductive Adhesive
bulletSurface Mount Device Adhesives

.
TACKING, POTTING, ENCAPSULATING
Typical Uses
Coil terminating
Micro-electronic encapsulants
Components tacking
Connector sealing
Potting switches
Telecommunications
Tamper proofing screws
Wire tacking on PCBs
Transformer sealing
Wire strain relief
Transformer sealing
Screw hole sealing
Capacitor potting
Glob top encapsulation

Dymax Product

Characteristics

Cure Depth
(inches)

Tensile Strengt h psi

Cure Mechanism

Cure Speed (sec)

Nominal Viscosity (cp)

950

Superior bonding to glass & epoxy board, excellent moisture resistance, deep cures

1.0

2,000

UV Light

<5

400

952

Fast curing, high strength, flexible, excellent moisture resistance

1.0

55

UV Light

<2

475

955

High Strength with superior adhesion to steel, aluminum and glass

0.50

2,000

UV Light or Heat

<5

4,000

956

High strength and flexible , excellent for bonding dissimilar materials

0.25

2,800

UV Light or Heat

<10

5,000

957

Designed to adhesre to a wide variety of materials, high strength

0.10

3,500

UV Light or Heat

<15

650

9-20273

Adhesion to wide variety of substrates; high strength; cure with UV light or visible light

0.10

3,5000

UV Light or Visible

<10

650

DYMAX PRODUCTS FOR
bulletConformal Coatings
bulletThermally Conductive Adhesive
bulletSurface Mount Device Adhesives

Conformal Coatings

Dymax Product

Characteristics

Cure Depth (inches)

Tensile Strength (psi)

Cure Mechanism

Cure Speed (sec)

Nominal Viscosity (cp)

984 Darc Cure

Tough, glossy, abrasion resistant, ideal for harsh environmental conditions, fluorescing, shadow cures at room temp to 7 mil

0.015

3,900

UV Light/Air (Room Temp)

<30 shadow 72 hr

90

984 TC

Tough, glossy fluorescing 2-part system, shadow cures at room temp to 1"

0.015

6,200

UV Light/Chemic al (Room Temp)

UV Light<5 Shadow <1 hr

Part A- 100
Part B- 70

984 Sure Cure

Tough, glossy fluorescing 2-part system, shadow cures at room temp to .25"

.25

6,200

UV Light/Chemic al (Room Temp)

UV Light<5 Shadow  6-24 hr

Part A- 100
Part B- 100

984-LVF
984
984T
984 Gel

Tough, glossy fluorescing with excellent adhesion to a variety of metal, ceramic, & glass-filled epoxy surfaces

0.015

6,200

UV Light then Heat

<5

160
400
2500
12000

986 Darc Cure

Flexible to maintain fragile component integrity, clear, fluorescing, reworkable, shadow cures at room temp to 7 mil

0.015

430

UV Light/Air (Room Temp)

UV Light <5
Shadow 72 hr

150

986

Flexible, g;lossy, deep curing,, reworkable

0.015

1,000

UV Light

UV Light <5

50

Thermally Conductive Adhesive

Dymax
Product

Characteristics

Cure Depth (inches)

Tensile Strength (psi)

Cure Mechanism

Cure Speed (sec)

Viscosity (cP)

991

Bonding heat sinks, improve thermal conductivity

0.10

2,500

Activator Heat or UV

<30

Paste 115,000

Surface Mount Device Adhesives

Dymax
Product

Characteristics

Cure Depth (inches)

Tensile Strength (psi)

Cure
Mechanism

Cure Speed (sec)

Viscosity (cP)

995 Rev.A

Fast curing, non-stringing, prevents skewing, recommended when maximum throughtput is required

N/A

3,000

UV Light or Heat

<1 min@120C

Paste 500,000

996

Can be stored at room remperature, recommended for high dot profile

N/A

4,000

UV Light ot Heat

<3 min @ 150C

Paste 120,000

 

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                        Last modified: January 09, 2008