Hysol
® H4000
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| Methacrylate Adhesive | |
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Description Dexter Hysol H4000 is a non-sagging, two component, room temperature curing, 10:1 mix ratio, methacrylate adhesive system. H4000 is formulated to reach fixture time rapidly. This adhesive forms resilient bonds and maintains its strength over a wide range of temperatures. H4000 is suitable for bonding a variety of substrates with a minimum of surface preparation for the most demanding bonding applications. Recommended Substrates: PVC, polycarbonate, acrylic, ABS, stainless steel, epoxy coated metal and FRP Features Non-sagging gaps filled to 1/2 inch Superior impact and peel strength Little or no surface preparation Offers excellent tolerance to off-ratio mixing Rapid room temperature cure100% reactive Excellent environmental resistance Typical Cured Properties Tensile Strength (psi) 2,700 – 2,900 ASTM D 638 Tensile Elongation (%) 30 – 40 ASTM D 638 Peel Strength (pli) 45 ASTM D 3167 Tensile Lap Shear @ 77o F (psi) 3,700 – 4,000 ASTM D 1002 Tensile Lap Shear @ 180 o F (psi) 1,900 – 2,100 ASTM D 1002 Shore D Hardness 75 – 80 Bondline Thickness (inches) .005 – 0.50 Typical Uncured Properties Part A Part B Mixed Open Time @ 77°F - - 7 - 10 minutes Fixture Time @ 77°F - - 15 – 20 minutes Color Cream Pale Yellow Pale Yellow Viscosity, cps 90,000 – 100,000 160,000 – 170,000 - Brookfield HBT Spdl 6 @ 10rpm Spdl 6 @ 10rpm - Specific Gravity 1.02 1.06 1.02 Pounds/gallon 8.50 8.84 8.53 Mix Ratio by weight 9 .61 - by volume 10 1 - Performance Handling and Application Mixing: It is highly
recommended that either meter mix equipment or cartridges with static
mix nozzles be used Applying: Bonding surfaces should be clean, dry, and free of contamination. Extensive surface preparation is not required for H4000, and good bonds can be formed on most substrates after a solvent wipe. To assure maximum bond strength, surfaces must be mated within the adhesive's open time. Use enough material to completely fill the joint when parts are clamped. Curing:Parts should remain undisturbed during the interval of time between the material's open time and fixture time. After the fixture time is achieved the material has reached handling strength. Temperature below 55°F will slow the cure; above 85°F will accelerate cure rate. Clean Up: It is important to clean up excess adhesive from the work area and application equipment before it cures. Denatured alcohol and many common industrial solvents are suitable for removing uncured adhesive. Hysol H4000 is flammable. Keep containers tightly closed after use. Keep away from heat, sparks, and open flames. Storage Hysol adhesives should be stored in a cool, dry place when not used for a long period of time. The shelf life for H4000 is one year from date of manufacture when stored at 40oF and six months when stored at room temperature or 77oF. Exposure above room temperature will reduce shelf life. Packaging 100 gram clip packs 490ml EPS cartridges 5 Gallon 55 Gallon Drums _______________________________________________________________________________________________________________ DISCLAIMER: The information supplied in this document is for guidance only and should not be construed as a warranty. All implied warranties are expressly disclaimed. Including without limitation any warranty of merchantability and fitness for use: All users of the materials are responsible for assuring that it is suitable for their needs, environment and use. All data is subject to change as Dexter deems appropriate. Users should review the Material Safety Data Sheet (MSDS) and product label for the material to determine possible health hazards, appropriate engineering controls and precautions to be observed in using the material. Copies of the MSDS and label are available upon request. _______________________________________________________________________________________________________________ For more information or to order contact the Glu Guru™ at 1-800-323-5158 or Email Us Here |