|
Adhesives
Acrylics
Aerosols
Anaerobics
Cyanoacrylates
Epoxies
Glue Dots
Hot Melt Adhesives
Methacrylates
Mold Releases
Sealants
Silicones
Solvent-Free
Structural Adhesives
Urethanes
UV Adhesives
Applicators
Accessories
Dispensers
Dual Dispensing
Epoxy
Hot Melt Dispensers
Hot Melt Bulk
Hot Melt Hoses
Hot Melt Rolls
Hot Melt Parts Nozzles/Parts
Motionless Mixers
Robots
Structural
Demonstrations
Bar Code Printer
Box
Printer
Equipment
Drum Unloader
Slot Die Applicator
Cold Glue Applicator
Fiberized Spray Pattern Controllers
Bulk Meters
Drum Meters
Adhesive Feeders
Metering Station
Supply Units
Applications
Carton Sealing
Electronic Materials
Encapsulants
Green Adhesives
Magnet Bonding
Marine Adhesives
Medical Device
One Part Adhesives
Packaging
Potting
Robotic
Solvent-Free Spray
Space Age Adhesive
Surfacing Adhesives
Transportation
Woodworking
Literature
About Bonding
Data Sheets
Journals
Line Card
MSDS
Tech Menu

Meeting Customer expectations
and requirements is the main objective
of ISO 9001:2008
Customer Survey
We would appreciate your help so that we can provide
you with the very best in services. Your response will help us address the areas
of performance needing improvement.
| |
Hysol
® 0151
Email |
| You may print this page for your file |
|
Epoxy
Adhesive |
Description
HYSOL® 0151 is a clear two-component epoxy having optical clarity
when used in small quantities. Hysol 0151 is easy to mix and has a
long pot life.
Recommended Substrates: Glass, Metals, Circuit Boards,
Fiber Optics and many Plastics.
Features
Clear Color
RT
or Heat Cure
Bonds
Many Materials
Easy to Mix
100%
Solids
Thixotropic
Paste
Typical Properties
Part
A
Part B
Mixed
Color
Milky
White
Amber
Clear
Viscosity, Poise
400
- 1000
200 - 1000
-
Specific Gravity @ 77°F
1.13
0.98
-
Handling
Mixing: This product requires mixing two components
together just prior to application. Complete mixing is necessary.
The temperature of the separate components prior to mixing is not
critical, but they should be close to room temperature.
Part
A
Part
B
By Weight
100
33
By Volume (cartridge 2:1-see note below)
2.7
1
Pot Life @ 77°F, 100 grams
60
minutes
Application
Mixing : Combine Part A (resin) and Part B
(hardener) in the correct ratio and mix thoroughly until the color and
consistency are uniform. EPOXI-PATCH® Tube Kits have been
designed so that squeezing EQUAL LENGTH BEADS of Part A 1 hour at
180°F; or 30 minutes at 250°F. Heat cures can be modified to
achieve a desired degree of cure from handling strength to full cure.
Mixing - Cartridges: Place
cartridge in proper dispenser. To begin using a new cartridge,
remove cartridge cap and dispense a small amount of adhesive, making
sure both Parts A & B are extruding. Attach nozzle and
dispense approximately 1-2" before applying onto the part to
be bonded. Partially used cartridges can be stored with the mixing
nozzle attached. To reuse, remove and discard the old nozzle,
attach the new nozzle, and begin dispensing.
**Note**Mix cartridge dispenses
adhesive in a 2:1 ratio. Tests show no significant effect on bond
performance compared to 2.7:1 ratio.
Application: Bonding surfaces should be clean and dry. For optimum
surface preparation, consult Dexter's Bulletin Preparing the
Surface for Adhesive Bonding. Once the adhesive is applied,
the bonded parts should be held in contact until the part has developed
handling strength. It is not necessary to clamp the parts unless
movement during cure is likely.
Cure: Complete cure is obtained after three days at room
temperature. After 24 hours, approximately 90% of full cure
properties are attained. Hysol 0151 will achieve handling strength in
6-8 hours at 77°F (note: this can vary with different bond
configurations). Hysol 0151 can also be completely cured with heat
such as: 2 hours at 140°F; 1 hour at 180°F; or 30 minutes at 250°F.
Heat cures can be modified to achieve a desired degree of cure
from handling strength to full cure.
Clean Up: It is important to remove excess adhesive from
the work area and application equipment before it hardens. Many common
solvents and citrus cleaners are suitable for removing uncured adhesive.
Consult with your supplier's information pertaining to the safe
and proper use of solvents.
Performance
Tensile Lap Shear Strength: Tested on etched aluminum
per ASTM D 1002.
Cure
Test
Temp. °F Typical
Results, psi
3 Days @ 77°F
-67
1600
77
1850
180
400
2 Hours @ 140°F
-67
2700
77
3000
180
600
1 Hour @ 180°F
-67
2700
77
3000
180
500
Bulk Properties
Hardness (Shore D)
85
Minimum @ 77°F
Glass Transition (Tg)
136°F
Coefficient of Linear Thermal Expansion
47
x 10-6/°C
at 86° to 122°F per ASTM D696
Thermal Conductivity
5.6
x 10-4 cal x cm/cm2 x sec x °C
Dielectric Strength
1080
volts/mil, 5-18 mil film
Dielectric Constant
3.88
at 77°F, 1 kHz
Volume Resistivity
1.26
x 10+15 at 77°F, ohm/cm, 100V
Dissipation Factor
5.3
x 10-4at 77°F, 1 kHz
Fungus Resistance
Does
Not Promote Fungus Growth per ASTM G-21
Elongation at Break
2.4%
Linear Shrinkage
less
than .3%
Moisture Absorption
less
than .5% after 24 HR Immersion @ 77°F
Packaging
50 ml and 200 ml EPS Cartridges
Quart,
One Gallon and Five Gallon Systems
2.8 oz. Epoxi-Patch Tube Kits
|
DISCLAIMER: The
information supplied in this document is for guidance only and should
not be construed as a warranty. All implied warranties are
expressly disclaimed. Including without limitation any warranty of
merchantability and fitness for use: All users of the materials are
responsible for assuring that it is suitable for their needs,
environment and use. All data is subject to change as Dexter deems
appropriate.
Users should review the Material Safety Data Sheet (MSDS) and product
label for the material to determine possible health hazards, appropriate
engineering controls and precautions to be observed in using the
material. Copies of the MSDS and label are available upon request.
|
|