ADHESIVE FOCUS NEWS
JOURNAL
The
Glu Guru welcomes you to
Cost Cutting Information helpful to your
Production and Packaging needs
Production and Packaging needs
Product Thermogrip® H1714 is a low application temperature hot melt adhesive for case forming and sealing applications.
RIGID PACKAGING
ADHESIVEProduct Description-Thermogrip® H1714 is specifically designed to provide very low application temperatures (250°F to 275°F) while still providing fiber-tearing bonds over a wide temperature range on a variety of substrates.
Basic Uses-You can have confidence in the performance of H1714 in your process across a wide range of conditions and materials due to:
- The Low Application Temperature Requirements of H1714-Up to 100F lower than conventional Hot melts. Cost savings in your process due to energy savings, increased equipment longevity, and decreased risk of severe burns by your operators.
- The Extended
Temperature Resistance of H1714-Provides fiber-tearing bonds
over a wide
temperature range on a variety of
substrates.
- The Excellent
Adhesion of H1714-Adheres well to board with a wide range of
recycled content as well as varnished, coated, and difficult
substrates.
- The Process Ease
of H1714-
- Clean running with little or no stringing.
- Low application viscosity.
- Excellent thermal stability and resistance to
charring.
Viscosity at 250°F: 1375 cP
Viscosity at 275°F: 850 cP
Viscosity at 300°F: 550 cP
Softening Point: 164°F
Specific Gravity: 98 g/cc
Suggested Running Temperature: 250°F to 300°F
For more information and/or to place an order Call 1-800-323-5158
| VISIT OUR WEBSITE AT www.gluguru.com One Stop Source for Adhesives, Dispensers, Accessories
© Copyright 2010
On-Hand Adhesives, Inc All rights reserved |